Multi-Scale Porous UHTCs: Dual Approach to Passive Cooling Components Design and Manufacturing
| Reference | Presenter | Authors (Institution) | Abstract |
|---|---|---|---|
| 14-063 | Carolina Tallon | Tallon, C.(Virginia Tech); | The development of active and passive cooling elements for extreme applications, such as hypersonic vehicles, is paramount to providing strategies to deal with the severe conditions these vehicles must endure. These conditions include large heat fluxes and extreme temperatures, extensive thermal gradients, stagnation pressures and oxidative environments. The active and passive cooling elements must be able to withstand these, while minimizing material ablation, the overall weight of the element and meeting the complex shapes and tolerances required for integration with other components in the aircraft. Multi-scale porous UHTCs with a suitable combination of microstructure (pore size, pore type and pore amount) and properties (thermal conductivity, pore network connectivity and thermomechanical response) may be able to meet the necessary requirements for these components. However, deciding what that suitable combination of microstructure and properties is the real challenge. In this work, a dual approach to passive cooling components design and manufacturing will be discussed. The dual approach consist of an integrated combination of predictive thermomechanical modelling of porous UHTCs with tailored processing approaches to create the required porous structures to match the desired performance. Computational approaches (Lattice Monte Carlo, Finite Element Analysis and Materials Point Method, in combination with Mori-Tanaka approximation and Eshelby equivalent inclusion method) are validated by corresponding experimental characterization of actual multi-scale porous UHTCs. The processing approaches rely on colloidal processing techniques (replica, particle stabilized foams, ice templating and electrospun fibers sacrificial fillers) that produce UHTCs with 50-90% porosity and pore sizes between 5 and 500 um. This dual integrated computational material engineering approach will help develop more efficient design and manufacturing for these components.
|
| << Back | |||